Interfacial Microstructure between Copper Ribbon and Nickel-coated Copper Plate Formed by Ultrasonic Bonding
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چکیده
منابع مشابه
Microstructure Examination of Copper Wafer Bonding
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Evolution of microstructure morphologies and grain orientations of Cu-Cu bonded wafers during bonding and annealing were studied by means of transmission electron microscopy, electron diffraction and X-ray diffraction. The bonded Cu grain structure reaches steady state after post-bonding anneal. An abnormal (220) grain growth was observed during the initial bonding process. Upon annealing, the ...
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ژورنال
عنوان ژورنال: QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY
سال: 2013
ISSN: 0288-4771
DOI: 10.2207/qjjws.31.188s